bonding technology发音

意思翻译

焊接工艺

相似词语短语

bonding───v.黏合；建立关系；把（货物）存入关栈中（bond的现在分词）；n.人与人之间的关系；键合；粘合

ionic bonding───离子键；离子键结；离子结合

metallic bonding───金属键；金属结合剂；[物]金属键合

covalent bonding───共价键合；共价键；共价键结；共价结合

technology───n.技术；工艺；术语

baby bonding───小面额债券（票面百元以下）

bonding time───粘结时间

bonding process───粘结法；黏结法

atomic bonding───[化学]原子键

双语使用场景

applications of cryogenic adhesive bonding technology in SQUID non - magnetic Dewar and other fields are introduced.───介绍了低温粘接技术在SQUID 无磁杜瓦及其它领域中的应用。

silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.───硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。

Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system (MEMS) products.───微胶接技术非常适用于微机电系统产品的自动化装配过程。

As a new technique, bonding technology has been used widely in the maintenance of chemical engineering equipment.───纤维增强塑料因其具有优异的耐腐蚀性能而被广泛用于制作化工设备。

Hence, the new punching bonding technology from TOX company of Germany and its practical application are presented in this paper.───本文介绍了德国TOX公司的一种全新的冲压连接技术及其在实际生产中的应用。

A preliminary attempt at the application of MATLAB in the study of bonding technology of structural glulam made of Larch is made.───对MATLAB在落叶松结构用集成材胶合工艺技术研究中的应用进行了初步尝试。

Finally, by combining wafer bonding technology with other processes, a micro fluidic chip for hemocytometer is prepared.───最后，将多种工艺结合，制备了血细胞计数器的微流体分析芯片。

Finally, the application prospects of microwave flip-chip bonding technology is suggested and discussed.───随着应用频率的提高，微波芯片与基板间的互连更多地采用了倒装焊。

英语使用场景

In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM.

The preparation of metal bump and wire substrate have been researched, as well as flip-chip bonding technology.

Flip-chip bonding technology is a potential process in the electronic packaging.

A silicon wafer bonding technology and its application to new dielectric isolation combined with conventional V-shaped grooves are described.

Then, the ultrasonic bonding technology and quality control for soldered joint are described.

Hence, the new punching bonding technology from TOX company of Germany and its practical application are presented in this paper.