bonding temperature信息详情
粘接温度
bonding───v.黏合;建立关系;把(货物)存入关栈中(bond的现在分词);n.人与人之间的关系;键合;粘合
temperature───n.温度;体温;气温;发烧
ionic bonding───离子键;离子键结;离子结合
metallic bonding───金属键;金属结合剂;[物]金属键合
covalent bonding───共价键合;共价键;共价键结;共价结合
baby bonding───小面额债券(票面百元以下)
bonding time───粘结时间
bonding process───粘结法;黏结法
atomic bonding───[化学]原子键
Bonding temperature, bonding time and interlayer thickness have an obvious effect on the shear strength of the joints.───连接温度、连接时间和中间层厚度对接头抗剪强度具有较明显的影响。
The microhardness of the joints increases with increasing of bonding temperature, but it shows a peak value as the bonding time is prolonged.───接头显微硬度随连接温度的升高而明显提高,但随连接时间的变化存在峰值。
When bonding temperature was 1403 K, reaction layer grew fast at first and then slow down with the increase of bonding time.───在连接温度为1403 K的条件下,随着连接时间的增加,界面反应层厚度先快速增加,再缓慢增加。
bonding process parameters: bonding temperature, bonding pressure, bonding time;───焊接工艺参数:粘接温度,焊接压力,焊接时间;
Techniques for Lowering The Bonding Temperature in Ceramic to Ceramic or Metal Bonding Research───降低陶瓷与陶瓷或金属连接温度的技术
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