die bonder发音

意思翻译

芯片焊接机；模片结合器，裸片结合器

相似词语短语

die die die───死吧，死吧

die die───模具

bonder 480───粘合剂480

bonder cert───农民证书

bonder md───键合器md

bonder dr───邦德医生

bonder boat───债券船

bonder def───粘合剂定义

bonder inc───邦德公司

双语使用场景

IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.───集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。

Its accuracy will influence the accuracy of LED die bonder.───其精度直接影响到LED粘片的精度。

Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.───是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。

Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.───键合是IC元件生产的重要封装过程或工序，需要在芯片键合机上完成。

This paper introduces the original structure and principle of the bond head device for high speed die bonder designed by author.───本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理，并给出了主要设计参数和计算公式。

The device can replace the manual machine, and provide an additional equipment of varies die bonder.───该装置可取代手动装置，为各种粘片机提供配套设备。

This product design for IC assembly die attache process on die bonder machine.───本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。

The auto Die Bonder for SOT-23 transistor is a high-speed, high-precision, machinery-electronics integrated equipment.───SOT-23晶体管封装自动键合机是高速、高精度机电一体化精密设备。

A Real Time Multiple Targets Recognition Algorithm In The Full Automatic Die Bonder───全自动共晶粘片机实时多目标识别的实现

英语使用场景

Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.

The auto Die Bonder for SOT - 23 transistor is a high - speed , high - precision, machinery electronics integrated equipment.

This product design for IC assembly die attache process on die bonder machine.

The device can replace the manual machine, and provide an equipment of varies die bonder.

Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

This product design for IC assembly die bonding process on die bonder machine.