die bonding信息详情
钢模结合；小片接合；芯片焊接；模片键合
bonding───v.黏合；建立关系；把（货物）存入关栈中（bond的现在分词）；n.人与人之间的关系；键合；粘合
die die die───死吧，死吧
die die───模具
ionic bonding───离子键；离子键结；离子结合
metallic bonding───金属键；金属结合剂；[物]金属键合
covalent bonding───共价键合；共价键；共价键结；共价结合
baby bonding───小面额债券（票面百元以下）
bonding time───粘结时间
bonding process───粘结法；黏结法
Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.───芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响。
die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.───封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。
thermal resister of power LED is analyzed in this paper. Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.───分析了功率型LED热阻系统的构成，对采用银浆和环氧胶作为芯片键合材料的功率型LED热阻进行了对比研究。
Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.───键合是IC元件生产的重要封装过程或工序，需要在芯片键合机上完成。
Define the standard operating procedure of epoxy die bonding, which to be followed by operators.───制定银胶上片工程标准作业程序，以供作业人员之依循。
Eutectic Die Bonding Technology and Its Applications in MEMS Packaging───基于共晶的MEMS芯片键合技术及其应用
Detection Technique and Performance Analysis of Die Missing for Die Bonding───粘片机中芯片丢失的光敏检测方法及其分析
Hybrid Approach for Improving the Reliability of Die Bonding Process───改进晶片键合质量可靠性的综合分析方法
Effects of Die Bonding on MEMS Characteristics: Cell Library───芯片粘接工艺对MEMS性能影响的单元库法模型
- direct service area
- digital power meter
- die by
- digital preprocessing
- direct service circuit
- die calculation
- digital presentation
- direct services
- die cast metal
- digital pressing
- die casting a
- direct shear method
- digital printer
- direct shift
- die casting aluminium
- direct shift cvt
- digital prints
- die casting die
- direct shipment
- die casting dies
- digital process