underfill发音

意思翻译

n.未充满；填充不足

相似词语短语

soreness underarm───腋下酸痛

thundering waters───雷鸣般的海水

agencies under executive branch───行政分支机构

arundel house───阿伦德尔别墅酒店

thunder tickets───雷霆门票

undesirable effect───不良效果

observationally grounded───观测接地

hounded out───追寻到

undefined notice undefined───未定义通知未定义

under separate cover───adv.在另函中

双语使用场景

first underfill is filled between the first chip and the second chip in order to wrap the first bump.───第一底胶，填充在所述第一芯片与所述第二芯片之间，且包覆所述第一凸块；

with no-flow underfill is analyzed and compared with the case for conventional capillary-flow underfill.───用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题。

technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.───的倒装芯片一般采用底部填充技术以提高其封装的可靠性。

This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.───这使得完整意义上说，这是其次的图片现代芯片的颠簸和底层指出。

The results show that the residual moisture within underfill materials enhances the stress level in solder joint.───结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。

Discuss the necessary of flip chip underfill to ther mal fatigue failures. Put forward controlling parameter for flip chip underfill .───从热疲劳故障的角度论述了倒装芯片底部填充的必要性，介绍了倒装芯片底部填充的参数控制。

Does your SMT facility have underfill capabilities? If so, what machines do they use?───贵公司的SMT设施拥有底充胶能力吗？如果有的话，它们采用什么机器？

The influence of underfill and its material models on the reliability of flip chip package under thermal cycling───底充胶及其材料模型对倒装焊热循环可靠性的影响

Thermal conductivity prediction of underfill and its affects on the flip chip temperature field───底充胶导热系数预测及对倒装焊温度场的影响

英语使用场景

DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.

Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

Discuss the necessary of flip chip underfill to ther mal fatigue failures. Put forward controlling parameter for flip chip underfill .

Pot life is the useful life of an underfill encapsulant after it is removed from the freezer and thawed, typically determined by the ability to dispense uniform quantities at uniform speeds.

For avoiding the disadvantage of filling the underfill and keeping good reliability, this research proposes a novel concept of no underfill with constraint layer flip chip package.

It was found that the application of underfill encapsulation can improve reliability of flip chip significantly.