silver bond信息详情
银质债券
bond───vt.使结合;以…作保;vi.结合,团结在一起;n.(Bond)人名;(英、德、西、刚(金)、瑞典)邦德;n.债券;结合;约定;粘合剂;纽带
silver───vt.镀银;使有银色光泽;adj.银的;含银的;有银色光泽的;口才流利的;第二十五周年的婚姻;n.(Silver)人名;(法)西尔韦;(英、德、芬、瑞典)西尔弗;vi.变成银色;n.银;银器;银币;银质奖章;餐具;银灰色
amide bond───酰胺结合
peptide bond───[生化]肽键
bond arms───键臂
die bond───管芯焊接[连接],小片结法;芯片焊接
disulphide bond───[医]双硫键;二硫键
covalent bond───n.共价键;n.[物化]共价键
rates bond───利率债券
Silver brazing alloys will not flow over or bond to oxides. Oily or greasy surfaces repel fluxes, leaving bare spots which oxidize and result in voids and inclusions.───因为银钎焊合金并不会流过或粘接在氧化物上,而油污的表面及暴露的、容易氧化和导致空隙和杂物排斥焊剂。
silver atom and the hydroxyl group of tannic acid, which stabilize the Ag nanoparticles in the spatial reticulate structure of tannic acid.───纳米银颗粒与羟基发生电荷吸附作用,固定在鞣酸的空间网状结构中,稳定存在。
A silver solder, placed between the segment and the core, is heated above the melting point to bond the segment to the core.───银焊料、设置之间的核心部分,加热至熔点以上的债券为核心的部分。
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