photoresist信息详情
n.[电子]光刻胶;[印刷]光致抗蚀剂;[光]光阻材料
a photo───一张照片
photo ops───拍照机会(=photoopportunities,多指拍摄政治人物、名人或盛大场面的机会)
canvasback flying photos───浏览飞行照片
print photos───打印照片
photo studio───照像馆;[摄]照相馆;摄像工作室
holiday photos───度假时所照的相片
aviva photo───开始拍照
razorbill photo───剃须刀照片
photo free───无照片
photo ps───照片ps
This paper researches the influence of resin and wetting agent for the property of photoresist.───本论文研究了光阻剂中分别增加环氧树脂和润湿剂对其性能的影响。
Exposure dose should be changed with the thickness of SU-8 photoresist.───SU - 8胶的厚度确定曝光剂量的大小。
hole in an oxide opaque region of a mask or reticle or in a photoresist layer.───氧化物、掩模或标线的不透明区域,或光刻层中不需要的小孔。
When using the sputtering nickel system, photoresist and nickel Crosslinking became extremely easy-to-be strong enough to produce water.───在搁置溅射镀镍的编制洋,平刻胶与镍交联后变得格外坚硬,极易爆发水纹。
Where the UV light shines through, it chemically weakens the photoresist, leaving a pattern on the surface of the silicon.───在紫外光照射穿透的地方,光刻胶的化学特性会被削弱,使硅晶片表面留下图案。
Here are a few solutions: firstly, plasma kinetic dedust, in a high vacuum conditions, oxygen ions and photoresist or chemical reaction.───这边有几个处置方案:第一,等离子不兴尘法,在一个矮真空境况下,氧离子与平刻胶或化学精神反响。
A small undesired hole in an oxide, opaque region of a mask or reticle, or in a photoresist layer.───氧化物、掩模或标线的不透明区域,或光刻层中不需要的小孔。
Comparing with all the existing sacrificial layer materials, the photoresist being used as sacrificial layers has some advantages.───同现有的牺牲层材料相比,光致抗蚀剂作牺牲层材料具有一些优越性。
Coating compositions of the invention are useful as photoresist overcoat layers, including in immersion lithography processing.───本发明的涂料组合物可用作光致抗蚀剂的覆盖涂层,包括可用在浸渍平版印刷工艺中。
Therefore, organic pigment must to be fine and symmetrical in the photoresist.
An optimized UV-LIGA technique, based on SU-8 photoresist process, was successfully applied to manufacture the thick nickel hexagonal micromesh sieve-sheets with high open area.
No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.
According to the analysis of the photoresist process that got organic initiator conditions, nanometer of physical map was obtained.
The flow boards with micro channels were fabricated by photomask alignment and exposure system associated with photoresist coating technique.
The mathematics model that showed photoresist spin coating thickness evolvement on spherical surface was put forward.
First, holographic interference using a He-Cd (325nm) laser was used to create periodic line structure on an i-line sub-micron positive photoresist film.
Main factors of influencing photoresist thickness for dip coating is analysed in this paper. The thickness of photoresist is determined by it.
On the basis of Nickel mould plate fabricated by melting photoresist and electroforming PMMA cylindrical microlens arrays are fabricated by the replication technology of static casting plastic.
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