middle temperature信息详情

middle temperature发音

意思翻译

中间温度

相似词语短语

temperature───n.温度;体温;气温;发烧

middle───n.中间,中央;腰部;adj.中间的,中部的;中级的,中等的

critical temperature───[物][电子]临界温度;n.临界温度

temperature outside───室外温度

temperature rise───[电]温升;温度上升;温度上升,温升,升温

constant temperature───[热]恒温;定温;等温;等温,恒温

fluctuating temperature───波动温度;脉动温度;脉动温度,波动温度

low temperature───低温,低温度;[物]低温

annealing temperature───[机]退火温度;退火点;退火点,退火温度

双语使用场景

desorbed hydrocarbon technology introduced in this paper makes this part of hydrocarbons desorbed under low and middle temperature.───本文介绍的热释烃技术,通过在中低温度下热脱的方法解吸硅酸盐矿物中吸留的烃类。

In general, the water heater in the middle temperature state is the most energy-efficient.───热水器工作在中温状态是最节能的。

Key problems on energy saving of high emissivity coating at middle temperature are discussed.───本文论述高发射率涂料在中温下使用,节能的若干关键问题。

This paper focused on describing planning research of power generation from middle temperature flue gas waste heat in Jiao Zuo cement plant.───本文论述了焦作水泥厂中温烟气余热发电方案研究。

Study of middle temperature phosphating process───中温磷化工艺研究

Applications of High Corrosion Resistance Zinc-Calcium Middle Temperature Phosphating on Rolling Stock───高耐蚀锌钙中温磷化在机车车辆的应用

New Application Technology of Chemical Nickel phosphorus Plating from alkaline bath at Middle Temperature───中温碱性化学镀镍磷实用新工艺研究

Research and application of special effective middle temperature phosphating───特效中温磷化工艺的开发及应用

Instantaneous Sterilization Craft and Aseptic Middle Temperature Filling of Beer───啤酒瞬时杀菌工艺及无菌中温灌装

英语使用场景

Key problems on energy saving of high emissivity coating at middle temperature are discussed.

The deposit middle temperature meteoric hydrothermal ore deposit.

A test of lower middle temperature blackening on steel part was introduced.

We consider that the method of phosphatizing in room-temperature is successful, which can replace that in high and middle temperature.

The middle temperature has improved deposition efficiency and is benefit for reducing burning of alloys.

An one-component adhesive curing middle temperature is composed of epoxy rein, incubative curing agent, accelerant and compounded filler, which can be used in SMT and LCD.