semiconductor wafer信息详情
[电子]半导体薄片
wafer───n.(Wafer)人名;(英)韦弗;n.圆片,晶片;薄片,干胶片;薄饼;圣饼;vt.用干胶片封
semiconductor device───半导体器件,半导体装置;[电子]半导体器件;半导体装置;半导体掐
wafer mapping───[电子]晶片图;晶片图形布置
national semiconductor───美国国家半导体公司
dummy wafer───假片
semiconductor diode───[电子]半导体二极管
cypress semiconductor───赛普拉斯半导体
wafer notch───晶圆缺口
sapphire wafer───蓝宝石晶片
present an on-wafer measurement technique of semiconductor wafer using special coplanar microwave probes.───本文描述了使用共面微波探针的半导体芯片在片测试技术。
It takes around 13 cubic metres of freshwater to produce a single 200mm semiconductor wafer, for example.───例如,制造出一块2分米长的半导体晶片需消耗13立方米的水。
Both types of chip are manufactured in batches on a single semiconductor wafer that is cut into individual chips.───这两种芯片都是先在一张半导体薄片上成批生产,然后再切割成一个个芯片的。
This strategy also eliminates the high cost of owning and operating a semiconductor wafer fabrication facility.───这种战略也使我们无需以高昂的费用购买和操作半导体晶片制造设备。
Mr. Yong Liu has more than 15 years ofoperations management experience at semiconductor wafer and solar cellmanufacturing facilities.───YongLiu先生有超过15年的半导体晶圆和太阳能电池生产运营管理经验。
Based on the invention, a plurality of ICs are formed on the semiconductor wafer during * process.───根据本发明,在制造过程中在半导体晶片上形成多个集成电路。
It takes around 13 cubic metres of freshwater to produce a single 200mm semiconductor wafer, for example.───例如,每生产一个规格为200毫米的半导体晶片就要消耗掉13立方米的淡水。
Compound Priority Control Strategy and Its Applications in Semiconductor Wafer Fabrication───复合优先级控制策略研究及其在半导体生产线调度中的应用
The Bottleneck-Oriented Dispatching Strategy and Parameter Optimization in Semiconductor Wafer Fabrication System───面向瓶颈的半导体晶圆制造系统派工策略及参数优化
A new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling.
The invention provides a semiconductor wafer, a semiconductor chip and a method and an apparatus for processing the wafer.
Semiconductor wafer manufacturing: batch, semi-automated 25-wafer, single or dual chamber chemical stripping, developing and cleaning tool.
Applicable scope: semiconductor wafer, optical glass, horologe parts, glasses, jewelry, polyester filtering cores, etc.
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