plating rate信息详情
电镀速度
gold plating───[化工]镀金；镀金，馏金
turret plating───转台电镀
plating technician───电镀技师
plating process───电镀工艺
plating rack───[化工]电镀支架
plating styles───电镀风格
plating technology───电镀工艺
plating tester───电镀试验机
satin plating───缎面镀层
effects of plating conditions on the plating rate, the deposit composition, and the magnetic properties of the deposit were studied.───研究了沉积条件对沉积速率、镀层组成和磁性能的影响。
The chemical Ni P plating mechanism in acid baths and the major aspects which influence the plating rate and P content of Ni P alloy coatings were discussed.───从镍磷化学镀的反应机理出发，讨论了反应中影响磷沉积速率和镀层中磷含量的主要因素，试验制备了含磷量较高且抗蚀性良好的镍磷镀层。
Experimental results indicate that compare to single stabilizing agent, compound stabilizing agent has higher plating rate, better stability and lower porosity.───结果表明：复合稳定剂比单一稳定剂镀速高、稳定性好、孔隙率低。
Analysis of magnesium alloy chemical bath main salt, reducing agent concentration, pH value, agent for the plating rate impact.───分析镁合金化学镀液的主盐、还原剂浓度、pH值、络合剂对镀速的影响。
Effects of compound chemical plating Ni-P-graphite on plating rate───复合化学镀Ni-P-石墨工艺对镀速的影响
Effect of complexing agent on plating rate in electroless nickel solution───化学镀镍溶液中络合剂对镀速影响的研究