polyimide信息详情
n.[高分子]聚酰亚胺
gnaphalium polycephalum 6x───多头黑麦草6x
european polymer journal───欧洲聚合物杂志
polynomial function───n.[数]多项式函数
polytheistic society───多神社会
degree of a polynomial───[数]多项式的次数
polybasic base───多元碱基
polychlorinated biphenyls───多氯联苯;[化] 多氯化联苯
polychrome jasper───多色碧玉
polymerization yu-gi-oh───聚合-yu-gi-oh
factoring polynomials───分解多项式
Polyimide is a macromolecule polymer material.───聚酰亚胺是一种高分子聚合物材料。
The second polyimide polymer is prepared with aromatic tetracid dihydride and aromatic diisocyanate.───第二种聚酰亚胺聚合物是芳香族四酸二氢化物与芳香族二异氰酸酯反应生成的。
Coils are made of single polyimide wire wrapped with glass fibre. The insulation level is Class h.───线圈均由单玻璃丝聚酰胺漆包线制成,绝缘等级为H级。
The adhesive performance of polyimide based binder, which had excellent heat resistance, to PTFE microporous membrane was studied.───研究了具有优异耐热性的聚酰亚胺胶黏剂对聚四氟乙烯微孔薄膜的粘接性能。
Experimental results showed that particles distributed evenly throughout polyimide and the crystal structure of particles did not change.───结果表明,锆钛酸钙钡粒子可以均匀地分散在聚酰亚胺基体中,而且晶型稳定;
The changes of structure and its effect on performance of polyimide film have been studied at different carbonization temperature.───研究了聚酰亚胺薄膜在不同碳化温度下,材料内部结构转变规律及其对材料性能的影响。
The results showed that the state of polyimide moulding powder changed with heat treating temperature.───结果表明:随着热处理温度的不同,模塑粉的结晶形态也相应发生变化。
The structural formula of the polyimide resin is shown in formula I.───该聚酰亚胺树脂的结构式如式I所示。
The synthesis route and preparation technology of the branch polyimide foam and polyimide nano-foam were introduced emphatically.───并介绍了侧链型聚酰亚胺泡沫塑料以及聚酰亚胺纳米泡沫塑料的合成路线和制备工艺。
QY polyimide enameled wire, slot insulation, slot wedges, insulation casing, primer wire and impregnating varnish must be used, such as H-class insulation material.
On this basis a new method for fabricating polyimide ridge waveguides by photobleaching technique and using metal mask is proposed.
The invention discloses norbornene-blocked polyimide resin, a preparation method and the application thereof.
Method for preparing 1,4-di(2,4-diamino phenoxy)benzenoid form polyimide film for flexible copper clad plate.
Bismaleimide(BMI) resin is a typical representative of polyimide of polyaddition type.
Taking 2,4,6-triaminopyrinide as triamine monomer, polyimide foams with cross-linked structures were prepared by foaming poly(ester-amine salt) precursor powders.
Application: Mainly used as raw material of polyimide, solidifying agent of epoxide resin.
Polyimide is a macromolecule polymer material.
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