molding compound信息详情
[塑料]模塑料;模制原料
molding───n.模塑件,铸造物;(装饰用的)嵌线,脚线
compound───n.[化学]化合物;混合物;复合词;有围栏(或围墙)的场地(内有工厂或其他建筑群);adj.复合的;混合的;v.合成;混合;恶化,加重;和解,妥协
molding choke───成型扼流圈
cavetto molding───凹圆线脚
button molding───包钮
molding machine───塑制机器; 切模机;造型机;铸模机
buffing compound───磨光剂;抛光剂
palatial compound───腭复合体
iron molding───金属型;锈痕
Mainly in a professional, bilingual supplement, molding compound personnel is our professional training objectives.───以专业为主,双语为辅,塑造复合型人才是我们专业的培养目标。
Molding method, process, and equipment of injection molding of molding compound had been discussed in this paper.───论述了模塑料注射成型的方法、工艺、设备和模具设计方面的问题。
The sheet molding compound had an appropriate low viscosity to be molded at low pressure.───片材在模腔内有较低的粘度,适宜于低压成型。
The chopped fiber strands may then be used in a bulk molding compound and molded into a reinforced composite article.───然后将该短切纤维束用于块状模塑料中使用并模塑成增强复合制品。
The matrix formulation and technical properties and processing technology of the low pressure molding compound were studied in this paper.───本文探讨了低压模塑料的配方、性能及加工工艺。
Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.───对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias , solder ball and PCB board.───EPBGA构装体由七个部分所组成,分别为散热板、成形树脂、晶片、基板、热通孔、锡球及印刷电路板。
Ultramid 8267G HS BK-102 is a heat stabilized, black pigmented, 40% mineral and glass fiber reinforced PA6 injection molding compound.───102是一种热稳定,黑色颜料,40%的矿物和玻璃纤维增强尼龙注塑成型化合物。
Study on Parameters Affecting Properties of Epoxy Molding Compound for Integrated Circuit Packaging───集成电路封装用环氧树脂模塑料性能影响因素研究
Bulk Molding Compound is specifically formulated for injection molding of automotive headlamp reflector applications.
Application:Melamine resin molding compound can be applied in a wide range, mainly for producing various melamine porcelain-like tableware used by hotels, schools, fast food restaurants and household.
Molding method, process, and equipment of injection molding molding compound had been discussed in this paper.
At least one molding compound is formed and the molding compound, the first patterned solder resist layer and the second patterned solder resist layer are separated.
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