pecvd信息详情
abbr.等离子体增强化学汽相沉积（PlasmaEnhancedChemicalVaporDeposition）
insectivora species───食虫纲
pebbly jack───卵石杰克
bat fowling shakespeare definition───捕蝙蝠莎士比亚的定义
pied piper───n.穿花衣的吹笛手，善开空头支票的领导者；n.穿花衣的吹笛手；善开空头支票的领导者
optical telescope───[光]光学望远镜
trumpet like flower───小号花
a red pen───红笔
hindustan epaper───印度斯坦艾帕
a fat peach───肥桃
mightily and merely people───强大而纯粹的人
First of all, plasma physics, PECVD equipment and its process principles are explained.───首先，对电浆物理、PECVD设备及制程原理加以阐述。
of microcrystalline silicon thin films were fabricated by VHF-PECVD at different substrate temperatures (Ts).───采用VHF-PECVD技术制备了不同衬底温度的微晶硅薄膜样品。
The electrical and structural properties of microcrystalline silicon thin film and solar cells fabricated by VHF-PECVD were studied.───本文对VHF PECVD制备的本征微晶硅薄膜和电池进行了电学特性和结构特性方面的测试分析研究。
In this dissertation, we changed the PECVD technique parameters, and deposited amorphous, microcrystalline and polymorphous silicon films.───本论文通过改变PECVD工艺条件，制备了非晶、微晶和多形硅三种氢化硅薄膜。
This paper gives an overview of plasma enhanced chemical vapor deposition (PECVD) used in the solar industry.───本文针对电浆辅助化学气相沉积在太阳能产业上的应用作一概略性的介绍。
Amorphous silicon is deposited at low temperature with plasma-enhanced chemical vapor deposition (PECVD).───非晶硅是存放在低温等离子体增强化学气相沉积（等离子体增强化学气相沉积）。
Plasma enhanced chemical vapor deposition (PECVD) technique is the primary method which is used to prepare hydrogenated silicon film.───等离子体化学气相沉积技术制备氢化硅薄膜工艺条件成熟稳定而成为薄膜制备的首选方法。
Experimental study of breakdown characteristic of thin dielectric film in nanometre range formed by low temperature PECVD───PECVD法低温形成纳米级薄介质膜击穿特性的实验研究
A-C:F thin films were prepared by PECVD method under different conditions.
We studied the relationship between the RF power, the chamber pressure and the film stress for deposited the silicon nitride film by Plasma Enhance Chemical Vapor Deposition(PECVD).
A double-deck plasma enhanced chemical vapor deposition (PECVD) facility was used to prepare silicon nitride film on the finely polished (100) plane ofp-type single crystal silicon wafer.
The glass composite thin films were deposited on silicon substrates by plasma enhanced chemical vapor deposition method (PECVD).