hypophosphite信息详情
n.[无化]次磷酸盐
hypophosphites───n.[无化]次磷酸盐
hypophosphate───n.[无化]连二磷酸盐
hypophosphates───n.[无化]连二磷酸盐
pyrophosphate───n.[无化]焦磷酸盐；焦磷酸酯
hypophosphoric───低磷
pyrophosphates───n.[无化]焦磷酸盐；焦磷酸酯
fluophosphate───氟磷酸盐
hyposulphite───n.硫代硫酸钠（等于sodiumthiosulphate）；连二亚硫酸盐（等于hydrosulphite）
monophosphate───n.单磷酸盐
impurities removing in production of sodium hypophosphite is focused in the paper.───重点论述了次磷酸钠工业生产中的杂质去除问题。
Based on catalyzing hypothesis of sodium hypophosphite, we explored and studied a non-phosphorus catalyst---sodium nitrilotriacetate.───依据次磷酸钠在体系中的催化作用开发和研究了无磷催化剂氨三乙酸钠。
Acid electroless nickel phosphorus plating on PZT ceramic was studied with hypophosphite as a reducing agent.───磷酸钠为还原剂，在压电陶瓷表面进行酸性化学镀镍磷。
The process of hypophosphite electrooxidation on a nickel electrode could be well simulated by this model.───结果表明，该模型能很好地模拟次亚磷酸根在镍电极上的电化学氧化过程。
The technological process for preparing phosphorous acid from the production waste of sodium hypophosphite was described.───介绍了从次磷酸钠生产废渣中回收提取亚磷酸的工艺。
All four preferred electroless baths use hypophosphite as a reducing agent.───所有四个优先使用化学浴次磷酸钠作为还原剂。
The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed.───探讨了次亚磷酸钠体系化学镀镍沉积机理。
Direct Copper Plating Using Sodium Hypophosphite as Reductant on the Surface of Plastics───以次亚磷酸钠为还原剂的塑料直接镀铜
A Study of the Reduction Efficiency of Sodium Hypophosphite in Low Temperature Electroless Nickel Bath───低温化学镀镍液中次磷酸钠还原效率的研究