bonding layer信息详情
粘结层;粘合层
bonding───v.黏合;建立关系;把(货物)存入关栈中(bond的现在分词);n.人与人之间的关系;键合;粘合
layer───vt.把…分层堆放;借助压条法;生根繁殖;将(头发)剪成不同层次;n.层,层次;膜;[植]压条;放置者,计划者;vi.形成或分成层次;[植]通过压条法而生根
ionic bonding───离子键;离子键结;离子结合
metallic bonding───金属键;金属结合剂;[物]金属键合
covalent bonding───共价键合;共价键;共价键结;共价结合
baby bonding───小面额债券(票面百元以下)
bonding time───粘结时间
bonding process───粘结法;黏结法
atomic bonding───[化学]原子键
Rural Buildings; Building energy saving; Sandwiched insulation roof panel; waterproof mortar; steel mesh; bonding layer; calcium silicate board.───村镇住宅; 建筑节能; 夹芯式保温屋面板; 防水砂浆; 批荡网; 粘结层; 硅酸钙板;
piezoelectric actuators are pasted to main structure by the bonding layer to transfer the strain and to achieve the control of the structure.───压电驱动器应用时要通过胶粘剂与主体结构固结,达到传递应变,实现控制结构变形的目的。
bonding layer is adhered between the first chip and the second chip.───粘着层粘着于第一芯片与第二芯片之间。
and a bonding layer is arranged between the second braid and the rubber outer layer.───第二编织层和橡胶外层之间设有粘合层。
As results, the actuation force of piezoelectric actuator is estimated excessively when the effect of the bonding layer is not considered.───结果表明:忽略粘贴层的影响,将过高地估计压电片产生的驱动力;
Conclusions Diminish the thickness of bonding layer can decrease the stress of porcelain laminate veneers at normal bite occlusion.───结论在正中加载状态下,减小粘固层厚度可以降低瓷贴面的应力。
Through its two materials closely bonding layer, which is guaranteed to multilayer structure integrity.───通过它紧密粘接两种材料层,即能保证多层材料的结构完整性。
The bonding layer is adhered between the first chip and the second chip.───粘着层粘着于第一芯片与第二芯片之间。
Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer───特种绕组线规范.155级带粘结层的可焊接聚氨酯漆包圆铜线
The porous nano-structure is used as a bonding layer, and thermocompression bonding can be realized at lower temperature and pressure due to the nano-scale effect.
- bonding joint
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