bonding characteristic信息详情
成键特征;结合特征
bonding───v.黏合;建立关系;把(货物)存入关栈中(bond的现在分词);n.人与人之间的关系;键合;粘合
characteristic───adj.典型的;特有的;表示特性的;n.特征;特性;特色
ionic bonding───离子键;离子键结;离子结合
control characteristic───[电子]控制特性
metallic bonding───金属键;金属结合剂;[物]金属键合
qualitative characteristic───质的性状;属性特征
characteristic polynomial───[数]特征多项式
characteristic meaning───特征意义
carboxyl characteristic───羧基特性
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.───根据这些曲线,说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.───根据这些曲线,说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
The bonding strength calculating formulas are presented. Which were referred to the tensile characteristic of concrete, and shows good agreement with the test results.───给出了与混凝土本身抗拉性能相关的、与试验结果符合良好的粘结强度计算公式。
The bonding characteristic of titanium and RG experiment porcelain───RG实验低熔瓷与钛的结合性能分析
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