bond pad信息详情
接合焊盘
pad───vt.（用软物）填补；abbr.（PAD）外周动脉疾病（peripheralarterialdisease）；n.衬垫；便签簿；平板电脑；（直升机）起降场地；（火箭）发射台；（猫或狗的）爪垫；公寓；n.（Pad）（英）帕德（男子教名Patrick的昵称）
bond───vt.使结合；以…作保；vi.结合，团结在一起；n.(Bond)人名；(英、德、西、刚(金)、瑞典)邦德；n.债券；结合；约定；粘合剂；纽带
amide bond───酰胺结合
peptide bond───[生化]肽键
incontinent pad───尿失禁垫
helicopter pad───直升飞机起降场；直升机起落坪
footing pad───脚垫；鞋垫
bond arms───键臂
die bond───管芯焊接[连接]，小片结法；芯片焊接
To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.───为了用较小的规模模拟相对较长的金线和较大的焊盘，提出了一种温度场分析的等效方法。
Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).───钝化层(18)和聚酰亚胺层(22)将最后的互连层(16)和接合焊盘(28)隔开。
The distal end of the flexible arms 28 flexibly suspend the bond pad area 26 of the head support means.───在28灵活的双臂末端灵活暂停焊盘面积26头的支持手段。
The patterned bond pad includes a plurality of portions electrically connected to each other, and at least one opening therein.───第一图案化接合垫包括彼此电性连接的多个部位以及位于其内的至少一开口。
The bond pad (28) is then formed in contact with the barrier (26), and a wire bond (30) is then made to the bond pad (28).───随后形成接合焊盘（28）以接触阻挡（26），且随后对接合焊盘（28）完成线接合（30）。
The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface characteristics.