chip assembly信息详情
芯片组件
assembly───n.装配；集会，集合；n.汇编，编译
assembly room───[建]会议室；礼堂；装配室；n.会议室，会场
assembly hall───会馆；[建]礼堂；n.会馆，议场; 大礼堂; 礼堂; 会堂
crisper chip───脆片
hub assembly───毂组件，轮毂总成
in assembly───装配中
chip shot───打高球；近穴击球；削球；n.[体]近穴击球
potato chip───n.炸土豆片
chip dale───奇普戴尔
research experiments about the microassembly of capillary and microfluidic chip were done, which have proved that the assembly assignment can be finished successfully.───毛细管与微流控芯片装配问题作了实验研究，实验验证此自动微装配系统能够成功完成毛细管与微流控芯片的装配任务。
In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process.───在微电子中，使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.───在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
Intel has chip assembly and test facilities in Shanghai and the western city of Chengdu but has held back from manufacturing in China.───英特尔已在上海和成都建立了芯片组装和测试厂，但始终没有在中国开展制造业务。
Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling───固化残余应力对倒装焊底充胶可靠性的影响
Flip Chip Assembly Hybrid Optoelectronic Integrated RCE Photo-detector Arrays───倒装焊组装的光电混合集成RCE探测器面阵
General Unsigned Multi-bytes Division Based on Single-chip Assembly Language───基于单片机汇编语言的通用多字节无符号数除法的改进
In-Line Test Speeds Flip Chip Assembly───提高倒装芯片组装速度的在线测试