flip bonding信息详情
翻转键合
bonding───v.黏合;建立关系;把(货物)存入关栈中(bond的现在分词);n.人与人之间的关系;键合;粘合
flip───n.弹;筋斗;vt.掷;翻转;轻击;vi.翻转;蹦跳;adj.无礼的;轻率的
flip over───翻页;翻过来;突然翻转
ionic bonding───离子键;离子键结;离子结合
metallic bonding───金属键;金属结合剂;[物]金属键合
workderra flip───workderra翻转
covalent bonding───共价键合;共价键;共价键结;共价结合
baby bonding───小面额债券(票面百元以下)
bonding time───粘结时间
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.───本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.───将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等,并对它们的优缺点进行了分析。
With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.───采用多普勒激光振动测量系统,获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
This paper talks about the major supporting technologies for MCM package : the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding .