film bonding信息详情
薄膜粘合
bonding───v.黏合；建立关系；把（货物）存入关栈中（bond的现在分词）；n.人与人之间的关系；键合；粘合
ionic bonding───离子键；离子键结；离子结合
metallic bonding───金属键；金属结合剂；[物]金属键合
covalent bonding───共价键合；共价键；共价键结；共价结合
baby bonding───小面额债券（票面百元以下）
bonding time───粘结时间
bonding process───粘结法；黏结法
atomic bonding───[化学]原子键
male bonding───男子情谊
normal indenting is applied, the thin film bonding can be tested by this indenter and the results have been compared with that by scratch tests.───采用正压法测定气相沉积薄膜的结合强度并与划痕法作了比较。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.───将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
The product is made with6020polyester thin film coated with bonding agent and compounded with insulation paper.───该产品是有6020聚酯薄膜涂以粘合剂再与绝缘纸复合而成。
When the force of pigment absorbing binder is strong and binder system surface tension of the binder system is small, the film bonding strength is great.