failure mechanisms发音

意思翻译

破坏机理

相似词语短语

failure───n.失败; 失败的事/人; 没做到; 故障; 破产; 歉收；n.失败；故障；失败者；破产

defence mechanisms───防御机制(defencemechanism的名词复数形式)；n.防御机制( defence mechanism的名词复数 )

coping mechanisms───[医]应对机制

defense mechanisms───防卫机制；[心理]防御机理

locking mechanisms───制动机构；锁定机构

business failure───经营失败；[经管]企业破产；[经管]企业倒闭

failure notice───系统退信；发送失败通知

boot failure───自举失败；启动故障

mechanical failure───[机]机械故障

双语使用场景

Rutting, or permanent deformation, is one of the main failure mechanisms for asphalt concrete pavements.───车辙，又可称为永久变形，是沥青路面的主要破坏形式之一。

The failure mechanisms in high temperature PTC heater are complicated.───高温PT C加热器的失效机制比较复杂。

Physicalmodels, thermal stress induced failure mechanisms and property studies are discussed.───探讨了增强模型、热应力损毁机理和性能测试。

This greatly reduces the system complexity, cost, size, and weight, and eliminates failure mechanisms.───这大大降低了系统复杂性，成本，大小和重量，消除故障机制。

The equipment simulates and quantifies various failure mechanisms typically responsible for connector malfunction.───该系统可以模拟和量化典型故障，而这些故障经常引起连接器失灵。

Buehler's team carried out a series of atomic-level computer simulations that investigated the molecular failure mechanisms in silk.───比勒的团队进行了一系列原子水平的计算机模拟，以考察天然丝中分子失灵的机制。

A screening test in which devices are operated at high temperature for an extended period of time to accelerate failure mechanisms.───一种筛选测试方法，在这种测试中，器件在高温下运行一段时间，以加速劣质器件的损坏。

Finite element method is adopted to calculate and analyze the deformation and failure mechanisms and the rock-layer reverse cause.───采用弹塑性有限元法分析该类滑坡的变形破坏力学机制和反翘成因。

The failure mechanisms and the loading capacity of stiffened composite panels with stiffener runout are studied.───研究了复合材料加筋板筋条斜削区的失效过程并预测了结构的承载能力。

英语使用场景

Abstract: The major failure mechanisms of diamond coated cutting tools are flaking and breakthrough of diamond coating.

The main failure modes, failure mechanisms and application environment of long life Oxford type Stirling cryocooler were analyzed. High temperature operating accelerated life test method was adopted.

Physicalmodels, thermal stress induced failure mechanisms and property studies are discussed.

Furthermore, we will review major failure mechanisms operative in electronics components and PCB assemblies.

With the decrease of the MOS devices size , hot carrier effect failure get more and more heavy, it become one of the main failure mechanisms.

The failure mechanisms and the loading capacity of stiffened composite panels with stiffener runout are studied.