electronic package信息详情
电子(仪器)组件;电子包装
package───adj.一揽子的;vt.打包;将……包装;n.包,包裹;套装软件,[计]插件;组件;外壳;封装;程序包;数据包
electronic spreadsheet───电子表单
electronic machinery───电子机械
electronic mailbox───电子信箱;电子邮箱
electronic balance───[计量]电子天平
package control───扩展包管理器
electronic library───电子图书馆
application package───[计]应用程序包;n.应用程序包
electronic engineering───n.电子工程学
Therefore, research on temperature distribution and thermal stress of micro-electronic package is very important, which has both theoretical and practical significance.───因此,对微电子封装器件的温度分布以及热应力进行研究就显得十分重要,具有重要的理论和实际意义。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.───随着微电子封装密度的提高,板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
meet the needs of the electronic package materials, the thermal properties of the composites were analyzed.───适应电子封装选材的应用背景,对复合材料进行了热学性能分析。
With lead-free trend in electronic package, it is necessary to choose lead-free tin-base electrodeposits for electronics industry.───随着电子封装无铅化的趋势,选择无铅锡基镀层已成为必然。
The electronic package is damaged - -Treatment method: Change the package.───电子组件损坏——处理方法:更换组件。
Development of advanced electronic package devices promoted the study on the reflow soldering.───先进电子封装器件的出现推动了再流焊方法和设备的研究。
Ceramic Particles (Fibers) Filled Polymer Composites Used for Electronic Package and Substrate───陶瓷颗粒(纤维)增强聚合物复合电子封装与基板材料
Finite element numerical simulation analysis of electronic package subjected to thermal loading───电子封装件受热载荷作用有限元数值模拟分析
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
- elliptic transducer
- end file
- emotional labor
- embedded sql
- elementary model
- elevator frame
- emergency escape rope
- emotional measurement
- empty lots
- endlessnight
- elementary movement
- elliptic wing
- end filing system
- enantiomer
- emotional memory
- emergency evacuation
- empty love
- elevator fund
- electrostatic gyro
- electronic packaging
- elliptica