electroless nickel plating发音

意思翻译

化学镀镍

相似词语短语

nickel───n.镍；镍币；五分镍币；n.(Nickel)人名；(德、英)尼克尔；vt.镀镍于

gold plating───[化工]镀金；镀金，馏金

turret plating───转台电镀

plating technician───电镀技师

plating process───电镀工艺

plating rack───[化工]电镀支架

plating styles───电镀风格

plating technology───电镀工艺

plating tester───电镀试验机

双语使用场景

technique of electroless nickel plating on ceramic powder was studied.───在陶瓷粉末表面开展了化学镀镍的工艺研究。

The electroless nickel plating: with, improve the corrosion render ability.───镀镍：打底用，增进抗蚀能力。

Direct electroless nickel plating is a method for plating on magnesium alloy.───镁合金直接化学镀镍是其表面处理的一种方法。

It is shown that optimized Ni-P alloy coatings can be obtained with electroless nickel plating on the surface of AZ91 magnesium alloys.───此外研究了化学镀镍时间及镁合金基体镀前热处理工艺对AZ91镁合金表面镀层硬度及其与基体的结合力。

Generalized electroless nickel plating technology involves pretreatment technology, nickel plating technology and after treatment.───广义的化学镀镍工艺包括镀前预处理工艺、镀镍工艺和后处理工艺。

Electroless nickel plating on magnesium-lithium alloy was studied, and an appropriate pretreatment was determined.───对镁锂合金化学镀镍进行了研究，确定了合适的前处理工艺。

Several pretreatment methods for electroless nickel plating on hollow glass microspheres were investigated.───研究了对空心玻璃微球化学镀镍的几种前处理方法。

The techniques and application of electroless Nickel Plating on Microelectronic packaging was researched.───本文对微电子封装化学镀镍生产工艺及应用进行了研究。

Laying basis on this, carried out an improvement experiment on the techniques of the electroless nickel plating on magnesium alloys.───并且以此为基础，对镁合金化学镀镍的工艺进行了改进。

英语使用场景

The main treatment methods of spent electroless nickel plating solution include chemical deposition, catalytic reduction, electrolysis, ionic exchange, etc.

Composite powder for electroless nickel plating on copper matrix was prepared by means of hydrazine reduction.

Orthophosphite ions produced by oxidation of hypophosphite in an electroless nickel plating bath can be removed by precipitation with an alkali metal or alkaline earth metal cation such as calcium.

The techniques and application of electroless Nickel Plating on Microelectronic packaging was researched.

Black spot, air bubble and scaling are usally produced during electroless nickel plating of computer hard disk drivers at the contact site with rack.

Electroless nickel plating is introduced to metallize the optical fiber probe.

The influence factor on low - phosphorous electroless nickel plating is studied.

Firstly, the alloy was treated by stannate conversion treatment, and then electroless nickel plating was carried out on the conversion film.

It is showed the anti-infrared capacity of the electroless nickel plating mica powder is more than the mica powder's.