die attach信息详情
管芯连接;芯片键合
attach───vi.附加;附属;伴随;vt.使依附;贴上;系上;使依恋
die die die───死吧,死吧
die die───模具
attach to───vt.依附,附属;加入;使依恋;把…放在;(使)贴[系,粘]在…上; (使)相关; (使)牵连; (使)依附
attach view───附加视图
attach proposal───附上建议书
die my die───死吧,我的死
die me die───死吧我死吧
die───vt.死,死于……;vi.死亡;凋零;熄灭;n.冲模,钢模;骰子;n.(Die)(法、美、德)迭(人名)
Today, semiconductor products use high-lead containing solder for a die attach material in various devices.───今天,半导体产品使用高含铅的各种设备,模具材料附着焊锡。
The five company consortium is known as the DA5 (Die Attach 5).───这五个公司财团是被称为DA5(模具附加5)。
of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.───MOSFET的封装主要由晶圆切割,晶粒黏贴,焊线,封塑,切割成型这五大流程组成。
Enter Lower right corner. Using track ball move crosshair to lower right corner of the die attach pad. Press ENTER.───确定右下角的中心。按标线来移动跟踪球到邦垫或者邦线的中心,然后按回车确定。
The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.───MOSFET的封装主要由晶圆切割,晶粒黏贴,焊线,封塑,切割成型这五大流程组成。
Consider die attach and bonding issues, we choose the platform shape holder as our main structure when design the LED lamp.───考量固晶及打线技术,因此以平台式为主要发光二极体支架结构并进行透镜设计。
Explore New Challenges of Wafer Level Die Attach Film for Wafer Preparation Process───探索晶圆级芯片贴装薄膜和芯片制备集成工艺的新挑战
Wafer Backside Coating of Die Attach Adhesives───固晶粘合剂在晶圆背面的涂覆
- direct selling association
- digital photographer
- die attachment
- direct selling center
- die attusks
- digital photographic
- direct selling health
- die back in
- digital photographs
- die back in time
- direct selling is a good
- die back intime
- digital photography school
- direct selling is the sale
- direct selling is the sale of
- digital picture generator
- die backerei
- digital playground
- die backing
- direct selling news
- digital point processing