copper plating发音

意思翻译

[化工]镀铜；电镀铜；红铜

相似词语短语

copper───adj.铜制的；vt.镀铜；n.铜；铜币；警察；n.(Copper)人名；(英)科珀

gold plating───[化工]镀金；镀金，馏金

turret plating───转台电镀

plating technician───电镀技师

plating process───电镀工艺

plating rack───[化工]电镀支架

plating styles───电镀风格

plating technology───电镀工艺

plating tester───电镀试验机

双语使用场景

Copper plating, improve electricity with: render coating adhesion ability, and corrosion ability.───镀铜：打底用，增进电镀层附着能力，及抗蚀能力。

GRG, Copper plating, Stainless steel, Marble, Weathering steel, Custom carpet, Wood floors.───铜片，电镀不锈钢，大理石，耐候钢，定做地毯，实木地板。

copper plating process an electrolytic acid copper plating system?───电镀站是否有酸解电镀铜系统？

The influences of the intermediate and monomer brighteners commonly used in present acid copper plating on the hardness. . .───本文主要对目前国内外常见的酸性镀铜中间体、单体光亮剂对硬度的影响进行了测试研究。

In terms of cost management solution for high and low and the all things considered, sulfate copper plating is the vast majority of units.───根据本钱矮矮及溶液处置的不难难程度归纳思考，硫酸盐镀铜工艺被绝不小多数单元剥夺。

A kind of composite additive used for copper plating of chemical replacement on iron surface was investigated.───研究了一种用于钢铁基体化学置换镀铜的专用复合添加剂。

Production of copper plating technology commonly used by a copper with copper with coke, acid, phosphate copper with etc.───生产上常用的镀铜工艺有氰化镀铜、酸性镀铜、焦磷酸盐镀铜等。

The requirement of equipments for bright acid copper plating with sulfate bath is strict due to the specialties of the process.───硫酸盐光亮酸性镀铜，由于工艺的某些特殊性，对电镀设备要求很高。

英语使用场景

Copper plating technology is widely applied to the field of electronic materials manufacturing for the good electrical conductibility, heat conductivity and ductility of copper deposit.

Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer.

Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated.

Is the copper plating process an electrolytic acid copper plating system?

The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.

Is dummy - plating performed as part of the start-up procedure before electroless copper plating product?

The effect of maleic acid, potassium ferrocyanide and thiourea on electroless copper plating was investigated.

Copper was reduced by formaldehyde which was contained in the effluent of chemical copper plating, and EDTA in the effluent was reclaimed after acidify.

Cathodic polarization curve and cyclic voltammetric curve of sulfate copper plating solution are determined with 1286 electrochemical interface and rotating disc electrode.