chip scale发音

意思翻译

切屑秤

相似词语短语

scale───n.规模；比例；鳞；刻度；数值范围；n.（Scale）（意）斯卡莱（人名）；vi.衡量；攀登；剥落；生水垢；改变大小；vt.测量；攀登；刮鳞；依比例决定

crisper chip───脆片

chip shot───打高球；近穴击球；削球；n.[体]近穴击球

potato chip───n.炸土豆片

chip dale───奇普戴尔

chip ingram───芯片ingram

chip gaines───奇普·盖恩斯

said chip───奇普说

computer chip───电脑芯片

双语使用场景

The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.───该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。

continuing increase in chip scale and design gates, verification has become the main bottleneck in chip development.───芯片规模不断增加、设计门数不断增长，验证已成为芯片开发的主要瓶颈。

I'd bet it is reaping royalties from iPhone sales too — and will until its key chip scale packaging patent expires in 2010.───我打赌它也从iPhone的销售中获得了版税—并且会一直这样，直到它的关键芯片级封装专利在2010年期满。

With the continuing increase in chip scale and design gates, verification has become the main bottleneck in chip development.───芯片规模不断增加、设计门数不断增长，验证已成为芯片开发的主要瓶颈。

The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).───该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。

Special chip scale characteristic: -intensive reader mode 2 g standards for another new feature is the dense reader mode.───特别的芯片级特性：密集阅读器模式第二代标准的另一项新特性就是密集阅读器模式。

Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package───芯片叠层球栅阵列尺寸封装的焊球疲劳寿命预测

Performance Standard for Construction of Flip Chip and Chip Scale Bumps───倒装芯片及芯片级凸块结构的性能标准

英语使用场景

The Chip Scale Atomic Clock (CSAC), originally developed for DARPA, is 100 times smaller than its predecessors and uses 100 times less power as well.

However, the complexity of the design verification exponential with the increase of the chip scale.

The capability for accurate placement will continue to be important as chip scale packages and flip chip technology reduce pin pitches even further in the unending race for product miniaturization.

Wafer chip scale packaging(WCSP) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.