chip bonding发音

意思翻译

片接合

相似词语短语

bonding───v.黏合；建立关系；把（货物）存入关栈中（bond的现在分词）；n.人与人之间的关系；键合；粘合

ionic bonding───离子键；离子键结；离子结合

metallic bonding───金属键；金属结合剂；[物]金属键合

crisper chip───脆片

covalent bonding───共价键合；共价键；共价键结；共价结合

baby bonding───小面额债券（票面百元以下）

bonding time───粘结时间

bonding process───粘结法；黏结法

atomic bonding───[化学]原子键

双语使用场景

embedded active chip also can be realized by backside thinning and flip chip bonding.───通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。

dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.───研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。

company also undertake external chip bonding, SMT, plug-in, assembly and other services.───公司还对外承接芯片邦定、贴片、插件、组装等业务。

The company also undertake external chip bonding, SMT, plug-in, assembly and other services.───同时公司还对外承接芯片邦定、贴片、插件、组装等业务。

Finally, the application prospects of microwave flip-chip bonding technology is suggested and discussed.───随着应用频率的提高，微波芯片与基板间的互连更多地采用了倒装焊。

High viscosity, thixotropic paste for wire tacking, chip bonding and coil terminating.───高粘性，触变膏体，用于导线定位、片结合、线圈终端。

The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.───研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。

flip chip bonding technology used in modern micro - photoelectron package───现代微光电子封装中的倒装焊技术

Research on Flip-chip Bonding Techniques for Hybrid Focal Plane Array Applications───混成式焦平面阵列芯片倒装互连技术研究

英语使用场景

With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.

This paper talks about the major supporting technologies for MCM package : the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding .

The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding.

In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM.

This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.

Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.