wire bonding信息详情
[电]引线接合法
bonding wire───[机]焊线;接地线;[电]等电位连接线;接合线,焊线
bonding───v.黏合;建立关系;把(货物)存入关栈中(bond的现在分词);n.人与人之间的关系;键合;粘合
wire───vt.拍电报;给…装电线;vi.打电报;n.(Wire)人名;(英)怀尔;n.电线;金属丝;电报
ionic bonding───离子键;离子键结;离子结合
metallic bonding───金属键;金属结合剂;[物]金属键合
covalent bonding───共价键合;共价键;共价键结;共价结合
baby bonding───小面额债券(票面百元以下)
bonding time───粘结时间
bonding process───粘结法;黏结法
Wire bonding is a critical technique for realizing microwave hybrid circuit.───引线键合是实现微波混合电路的关键技术。
The first step is to model the close loop control system of wire bonding force.───两步走的策略被采用:第一步,建立键合力控制系统的闭环模型;
Set up ultrasonic wire bonding laboratory.───成立超声波电子焊接实验室。
Twisted-pair were in the wire bonding method sometimes used for coaxial cable, the method can make it smaller, lighter, cheaper.───在双绞线中黏合导线的方法有时也用于同轴电缆,这种方法能使其更小、更轻、更便宜。
Wire bonding today is used throughout the microelectronics industry as a means of interconnecting the chips, substrates and output pins.───引线键合技术是现代微电子封装中常用的一种技术。
Wire-bonding is one of the critical processes that determine the quality of IC packaging.───积体电路封装品质的良窳,焊线是一关键制程。
Another focus was on how the operating parameters affect the ultrasonic wire bonding.───分析了各工作参数对超声波线焊产生的影响。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.───在超声引线键合过程中,键合压力是影响键合强度的重要因素之一。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.───文章讨论了引线键合芯片与板上或有机基板上焊料凸点式倒装片的成本比较问题。
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