solder bump发音

意思翻译

焊料隆起焊盘；撞击焊；焊接凸点

相似词语短语

bump───adv.突然地，猛烈地；vt.碰，撞；颠簸；vi.碰撞，撞击；颠簸而行；n.肿块，隆起物；撞击；n.(Bump)人名；(英、西)邦普

bump box───缓冲盒

solder irons───烙铁；电烙铁

solder paste───焊膏；[机]焊锡膏

solder wick───锡线

jewelers solder───珠宝商焊料

fluxed solder───焊剂；熔剂

cooter bump───库特隆起

solder mask───焊接掩模；焊接淹模；阻焊层; 焊接掩模，焊接淹模

双语使用场景

of solder bump is one of the key technologies for area array packaging (AAP).───钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。

Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.───另外，由于柱状块不熔化，半导体线路板和组装线路板之间的距离不因焊料而变窄。

Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.───介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。

During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.───在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。

Process Flow of Electroplating Solder Bump───电镀焊球凸点工艺流程

Current Research on the Reaction between Solder Bump and under Bump Metallurgy Systems in Flip Chip───倒装芯片中凸点与凸点下金属层反应的研究现状

Research Status and Application of Laser Reflow on Solder Bump Forming of Area Array Packages───激光重熔在钎料凸点成形中的应用

Shear Fracture Model of Lead-free Solder Bump Formed with Induction Self Heat Reflow───感应自加热重熔无铅焊料凸台的剪切失效模式

Preparation of SnPb solder bump by electroplating process───电镀方法制备锡铅焊料凸点

英语使用场景